The BGA (Ball Grid Array) is a type of microchip package. BGA package use a group of solder dots, or balls, arranged in concentric rectangles to connect to a circuit board. Some pictures by way of illustration:
The BGA packages of different manufacturers of chips differs in all possible parameters - body size, ball matrix, lead-to-lead spacing (leads pitch), package thickness, ball alignment (perimeter, full array, part of array inside, etc.), ball height and diameter, ... . The variety of BGA packages is really huge, but it is not end of troubles. At the same package type, the different manufacturers use different signal alignment. Result of this situation is enormous number of necessary BGA converters.
In generally, the BGA converter consist of two board. The top board carry the BGA ZIF socket, that accept a certain BGA package dimension chips (for example 8x8 ball array, 11x8mm body size). The bottom board provide a proper interconnection from top board to the 48 pins, going to the ZIF socket of the programmer. The top board of the BGA converter is most expensive part of the BGA converter because of ZIF BGA socket price.
To offer you most effective solution of BGA converters, we've decided to split the BGA converter to BGA-Top and BGA-Bottom boards and offer them also separately. It results, you don't need to buy more BGA converters to program the chips in the same BGA package - you only have to use a different BGA-Bottom boards. We also come to conclusion to use the on-demand developed BGA sockets, which are insensitive to ball diameter and package thickness. This sockets also have a extreme mechanical lifetime - 500 000 actuations(!). In the case of too big tolerances of ZIF package dimensions manufacturing and in some special cases, there are used standard - 10 000 actuations - BGA ZIF sockets.
For example, if you want to program the W19B322MB in TFBGA48 and Am41DL1614DT in FBGA69 you have to order only one BGA-Top-3 ZIF-CS board and two bottom boards (BGA-Bottom-1 and BGA-Bottom-2). Another words you save - in the case of Elnec solution - more then 70% of complete BGA convertor price.
As you can see, the Elnec BGA package convertor is combination of different BGA-Top and BGA-Bottom board. Therefore the name and also the ordering number of the BGA converters is also combination of ordering number of the BGA-Top and BGA-Bottom board.