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Category: Main/5. Materials and chemicals for soldering and PCBA assembly/ 5.5. Glue and adhesive for PCBA assembly (Glue, adhesive, silicon, conformal coating)
| | | | | ◊ Đặc điểm chính: | | | | Kiểu keo lấp đầy (điền gầm) | | | Mầu đen | | | Tỷ trọng | | | Độ nhớt | Water absorption (%) (24hrs @ 25℃)
| | Độ hấp thụ nước | | | Sức chống cắt | | | Độ lấp đầy khoảng trống | | Cure condition | 80℃ 15min or 100℃ 5min | Điều kiện đông cứng | | Hardness (shore D) | 65 | Độ cứng | | Thermal conductivity (W/m℃) | 0.19 | Độ dẫn nhiệt | | 30ml tube, 50ml/250ml bottle | Đóng gói trong ống 30ml hoặc lọ nhựa 50ml/250ml | | | Hạn dùng 6 tháng, nhiệt bảo quản -20℃ | | Applications | Protect CSP, BGA, UBGA | Ứng dụng chính: bảo vệ chip dán CSP, BGA, UBGA... |
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Product description：
Hightite HT8087
is a single component, epoxy liquid filling material. Low halogen content, this
product has good mobility to through the gap of BGA or CSP.
Typical application：
Mainly used to
protect CSP, BGA, UBGA after assembling. For example: cellular phones, notebook
computers.
Typical properties： 
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Chemical composition：
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expoxy resin
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Color：
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black liquid
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Main parameter
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Typical
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Range
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Density (g/cm3)
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1.10
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1.05-1.15
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Viscosity
(MPa.s)
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3000
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2000-4000
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Flow velocity
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@50℃,0.25mm gap
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| Flow distance(mm) | Flow time(s) | | 10 | 35 | | 15 | 60 |
Recommend cure condition：
Cure
temperature (80℃), 15min
Cure
temperature (100℃), 5min
Curing speed depends on the
heating equipment and the size of the object to be bonded. According to the
heating device and the object to be bonded suitably adjusted cure time.
Properties after curing： 80℃ curing 30min | Main parameter | Typical | Range | | Appearance | Black light | | | Hardness（shore
D） | 65 | | | Elongation at break(%) | 3.8 | | | Shear
strength (MPa) | 18 | | | Tg (℃) | 56 | | | CTE (ppm/℃) | 65
192 | | | Thermal
conductivity (W/m℃) | 0.19 | | | Water
absorption (%)(24hrs@25℃) | 0.26 | | | Halogen content (ppm) | | Cl- <50
K+ <10
Na+ <10 |
Electric properties： | Main parameter | Typical | Range | | Surface
resistivity ( .) | 1.1×1015 | | | Volume resistivity ( .cm.) | 5.5×1014 | | | Dielectric strength (Kv/mm) | 16.5 | |
| Test point | Dielectric constant | Dielectric loss | | 1KHz | 3.5 | 0.017 | | 100KHz | 3.3 | 0.02 |
Store：
Under conditions of
refrigeration -20 ℃ sealing
dry; 6 months.
Direction for use： 1. At room temperature (23 ± 2 ℃)
warmed 3h be back to normal viscosity before use, do not open the package in
the previous. Unused glue should be sealed and placed in -20 ℃
refrigerator storage. Each package of products can be warmed 2-3 times, does
not recommend multiple warmed. 2. Can be filled directly at room temperature.
3. Recommend to use “一”shape or “L” shape coating，when use“一”shape, the adhesive length is the chip side length of 80%, dispensing
pressure is 0.1-0.3Mpa, dispensing speed is 2.5-12.7mm/s. 4. Under the condition of 25℃,
the adhesive can apply two days.
Repair function:
This component may be
repair when the component is defective, maintenance temperature of the heating
of the chip is required to achieve a temperature above the melting point of
solder 20-30 ℃, 30-90s
and maintained at this temperature, until completely melted solder with a
needle nose pliers light twist element, damage bonding layer, with vacuum
suction or forceps remove the components.
Clean function：
When the element is removed, you can use a flat end of a hard plastic brush
to clean the residual adhesive, when cleaning try to use minimal pressure on
the board to reduce the damage to the board, residue adhesive can be cleaned
with isopropyl alcohol.
Remark: Excessive brushing will increase the damage to the plate surface。
Notice：
1. Keep away from children's.
2. This product is recommended
for use in a well-ventilated place.
3. If you accidentally gets on
your skin, wash immediately with soap and water.
4. If you accidentally touches
the eyes, please wash with plenty of water and seek medical.
Technical
Service
If other problems encountered in use, please
contact the hightite technical services department.For Vietnam market, please contact TULA Solution Co., Ltd.
CÁC SẢN PHẨM KHÁC CÙNG NHÀ SẢN XUẤT / OTHER PRODUCTS FROM HIGHTITE |
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OUR GLOBAL PARTNERS
Minato, Leap, SMH-Tech, Xeltek, Elnec, Conitec, DediProg, Phyton, Hilosystems, Flash Support Group, PEmicro ||Rigol, Tonghui, Copper Mountain, Transcom, APM || Atten, Zhuomao, Puhui, Neoden, Ren Thang, Genitec, Edry, UDK ||
CONDITTION AND USING TERMS
TULA Solution Co., Ltd - Công ty TNHH Giải pháp TULA
Headquater: No. 173 Group 15, Dong Anh District, Hanoi 10000, Vietnam
Head-Office: No. 6 Lane 23, Đình Thôn street, Mỹ Đình ward, Nam Từ Liêm Dist., Hà Nội, Vietnam
Tel.: +84-24.39655633, Hotline: +84-912612693, E-mail: info (at) tula.vn |
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HT8087: Underfill epoxy adhesive - Keo epoxy điền gầm
